[ExI] Two Paths to Further Shrink Computer Chips

[Tomasz Rola]

On Tue, 31 Aug 2010, Jeff Davis wrote:

> And add this tech, hyped as "game-changing", enabling 3D chip architecture:
> 
> http://nextbigfuture.com/2010/08/applied-materials-claims-game-changing.html?utm_source=feedburner&utm_medium=feed&utm_campaign=Feed%3A+blogspot%2Fadvancednano+%28nextbigfuture%29&utm_content=Yahoo!+Mail
> 
> Best, Jeff Davis

This sounds nice, gives hopes that one day building a 1000-core cpu will 
be trivial (and I feel pervert pleasure thinking I would one day buy it 
used from internet for the cost of pocket radio).

But first, from what I've read, they have to solve problem of getting 
enough power in, and next, of getting heat out of it. There is this 
concept of putting pipes inside the cpu, with some coolant in them. But 
again, this might be nontrivial to do - somewhere again I've read, that 
silicon will broke off in microscopic pieces, in effect clogging the pipes 
and bursting the chip...

Perhaps reversible computing is the answer for heat problem, or at least a 
helper. But I've just started to scratch the glass surface, so I have very 
fogged understanding of this, ATM.

Regards,
Tomasz Rola

--
** A C programmer asked whether computer had Buddha's nature.      **
** As the answer, master did "rm -rif" on the programmer's home    **
** directory. And then the C programmer became enlightened...      **
**                                                                 **
** Tomasz Rola          mailto:tomasz_rola at bigfoot.com             **